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High Frequency Impedance Rogers PCB Circuit Boards 6 Layer PCB Manufacturing Process

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Shenzhen Xinchenger Electronic Co.,Ltd

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High Frequency Impedance Rogers PCB Circuit Boards 6 Layer PCB Manufacturing Process

Brand Name : XCE

Model Number : XCER

Certification : CE,ROHS, FCC,ISO9008,SGS

Place of Origin : China

MOQ : 1pcs

Price : negotiation

Payment Terms : T/T,Western union

Supply Ability : 1, 000, 000 PCS / week

Delivery Time : 5-10 days

Packaging Details : inner: vacuum-packed bubble bag outer: carton box

Base material : Rogers4350B

Name : Rogers PCB

Board thickness : 1.2mm

Copper THK : 3OZ

Board size : 16*14cm

Surface finish : Gold plating

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High Frequency Impedance Rogers PCB Control 6 Layer Circuit Board

Specification

PCB Type:	Rogers PCB
Layer :	6 layer
Min .Line Width/Space:	3mil/3mil
Min. Via Diameter:	0.3mm
Finish Thickness:	0.2mm
Surface Finish:	ENIG
Size:	16*14CM
Material:	4350B
Color:	golden
Application:	high technology

Description:

A dielectric material is a substance that is a poor conductor of electricity, and used as an insulating layer in the PCB build up. Porcelain, mica, glass, plastics and some metal oxides are good dielectrics. The lower the dielectric loss, (the proportion of energy lost as heat) the more effective the dielectric material. If the voltage across a dielectric material becomes too great -- that is, if the electrostatic field becomes too intense -- the material will suddenly begin to conduct current. This phenomenon is called dielectric breakdown.

Our high density circuit boards have the technology pushing capabilities to drive applications in a large number of industries including but not limited to semiconductor test equipment, defense, medical and aerospace.

Parameter

Profile tolerance			±0.10mm(4mil)
Board bend&warp			≤0.7%
Insulation resistance			＞1012Ωnormal
Through-hole resistance			＜300Ωnormal
Electric strength			＞1.3kv/mm
Current breakdown			10A
Peel strength			1.4N/mm
Soldmask regidity			＞6H
Thermal stress			288℃20Sec
Testing voltage			50-300v
Min buried blind via			0.2mm(8mil)
Outer cooper thickness			1oz-5oz
Inner cooper thickness			1/2 oz-4oz
Aspect ratio			8:1
SMT min green oil width			0.08mm
Min green oil open window			0.05mm
Insulation layer thickness			0.075mm-5mm
Aperture			0.2mm-0.6mm
Special technology			Inpedance,blind buried via,thick gold,aluminumPCB
Surface finish			HASL,lead free,Immersion gold,immersion tin,immersion silver,ENIG,Blue glue,gold plating

Product Tags:

Pcb Board Prototype

Pcb Design And Fabrication

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