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SMT / DIP Customized PCBA , PCB Assemblies With X-Ray AOI Testing For BGA

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Shenzhen Xinchenger Electronic Co.,Ltd

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Brand Name : XCE

Model Number : XCEA

Certification : CE,ROHS, FCC,ISO9008,SGS

Place of Origin : China

MOQ : 1pcs

Price : negotiation

Payment Terms : T/T,Western union

Supply Ability : 1, 000, 000 PCS / week

Delivery Time : 5-10 days

Packaging Details : inner: vacuum-packed bubble bag outer: carton box

Cu THK : 1OZ

Surface finish : HASL lead free

Material raw : FR4 2 layer

Processing : SMT

Solder mask : Green,white silk screen

Board Size : 10*5cm

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SMT / DIP Customized PCBA Assembly With X-Ray Testing For BGA

Specification:

Parameter

1	Layer	2 layer
2	Material	FR-4 lead free
3	Board thickness	1.2mm
4	Finished board side	40*20mm
5	Min.drilled hole size	0.25mm
6	Min.line width	0.25mm
7	Min.line spaceing	0.25mm
8	Surface finish/treatment	HALS/HALS lead free
9	Copper thickness	0.5-4.0oz
10	Solder mask color	green/black/white/red/blue/yellow
11	Inner packing	Vacuum packing,Plastic bag
12	Outer packing	Standard carton packing
13	Hole tolerance	PTH:±0.076,NTPH:±0.05
14	Certificate	UL,ISO9001,ISO14001,ROHS,CQC
15	Profiling Punching	Routing,V-CUT,Beveling
16	Assembly Service	Providing OEM service to all sorts of printed circuit board assembly

Quick detail:

Advantage:

1) Professional Surface-mounting and Through-hole soldering Technology

2) Various sizes like 1206,0805,0603 components SMT technology

3) ICT(In Circuit Test),FCT(Functional Circuit Test) technology.

4) PCB Assembly With UL,CE,FCC,Rohs Approval

5) Nitrogen gas reflow soldering technology for SMT.

6) High Standard SMT&Solder Assembly Line

7) High density interconnected board placement technology capacity.

SMT / DIP Customized PCBA , PCB Assemblies With X-Ray AOI Testing For BGA

Product Tags:

pcb board assembly

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